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Brick Line

Fully automated brick line

Full automation results in a reproducible process flow guaranteeing the best possible utilisation and efficiency of cost-intensive processes. The brick line uses these advantages in the entire pre-sawing area and combines the process stages of measuring, edge and surface grinding, cropping and gluing in one closed system.

Your advantages

  • 10 – 15% lower TCO over the whole wafering process and 3% higher yield
  • Elimination of handling failures and non-productive time, significant reduction of bottom chipping
  • Active and passive loading optimization allow up to 90 – 95% workload of the wire saws

Maximum process reliability and clear process identifiability and transparency are further advantages of full automation.

Process steps Brick Line

Before a silicon brick is processed into wafers by a wire saw, it passes through various process stages. Bar codes on the bricks help to identify them. The surface and edge grinding is then done in the grinding area. On the way to the cropping saw the bricks are measured by an IR device and inspected for quality defects. The top and tail cropping is carried out by the inner diameter saw using these measurement data. That’s where the inclusions, the so-called Not in order (NIO) parts are cut off. The NIO parts then are recycled and the quality compliant bricks are moved by the conveyor belt to the fully automated gluing station. The final stage of the process is gluing of the bricks to the workpiece holder. The gluing cell is programmed for maximum utilisation of the workpiece holder using active and passive loading optimization. The brick is now ready for the next process step on the wire saw.

Fact Sheet