Highest Yield in the shortest time

The DS 265 wire saw impresses with its consistently high wafer quality. The compact, modular-design and easily accessible machine can be universally deployed and gives you the option of a rocking unit or a double table. The highest yield for a big investment will give you the advantage.

  • Universally useable; research to production
  • Fast conversion for small batch sizes
  • Slurry or diamond wire as an option
  • Rocking unit, double brick reception as option


Flexible in use

The flexible DS 265 gives you two expansion options. The rocking unit optimizes the cutting length of the wire and supports the reduction of the cutting times. A double table offers you the facility of being able to cut two bricks simultaneously. An additional nozzle provides for optimum slurry supply when cutting. You can achieve top results with your cutting with both options.

Description Specifications
Square workpiece dimensions max. 156 x 156 mm (2x) / 200 x 200 mm (1x)
Round workpiece dimensions max. ø 6'' (2x) / max. ø 8'' (1x)
Loading length max. 300 mm
Area of wire ø   0,100 - 0,160 mm
Cutting medium standard wire with slurry; diamond wire with water and additive
Machine dimensions, l x w x h max. 3364 x 3094 x 2815 mm
Machine weight max. 6300 kg
Connection capacity max. 80 kW
Voltage / frequency 3 × 400 V / 50 Hz ; 3 x 480 V / 60 Hz
Compressed air 5,5 - 8 bar
Coolant water
Discharge air indispensable
Air-conditioned room advantageous

Description Example 1
Standard wire with slurry
Example 2
Diamond wire with water and additive
Material silicon sapphire
Loading length 600 mm (2 x 300 mm) 150 mm
Wafer size 125 x 125 mm ø 6''
Wafer thickness 200 μm 1500 μm
Wire thickness 120 μm 250 μm
Number of wafers per kg
of silicon
74,8 -
Number of wafer per year* ~ 2,00 ∙ 106 ~ 13,75 ∙ 103
* depends on customer's production parameters