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| Description | Specifications |
| Square workpiece dimensions | max. 156 x 156 mm (2x) / 200 x 200 mm (1x) |
| Round workpiece dimensions | max. ø 6'' (2x) / max. ø 8'' (1x) |
| Loading length | max. 300 mm |
| Area of wire ø | 0,100 - 0,160 mm |
| Cutting medium | standard wire with slurry; diamond wire with water and additive |
| Machine dimensions, l x w x h | max. 3364 x 3094 x 2815 mm |
| Machine weight | max. 6300 kg |
| Connection capacity | max. 80 kW |
| Voltage / frequency | 3 × 400 V / 50 Hz ; 3 x 480 V / 60 Hz |
| Compressed air | 5,5 - 8 bar |
| Coolant | water |
| Discharge air | indispensable |
| Air-conditioned room | advantageous |
| Description | Example 1 Standard wire with slurry |
Example 2 Diamond wire with water and additive |
| Material | silicon | sapphire |
| Loading length | 600 mm (2 x 300 mm) | 150 mm |
| Wafer size | 125 x 125 mm | ø 6'' |
| Wafer thickness | 200 μm | 1500 μm |
| Wire thickness | 120 μm | 250 μm |
| Number of wafers per kg of silicon |
74,8 | - |
| Number of wafer per year* | ~ 2,00 ∙ 106 | ~ 13,75 ∙ 103 |
| * depends on customer's production parameters | ||



