Highest Yield with the thinnest wire

The DS 264 cuts fundamentally more wafers at markedly lower cutting costs from mono and multi-bricks than comparable wire saws. This is due to the design which guarantees cutting with the thinnest wire. The modular design makes the working areas easily accessible and increases uptime of the machine.

• Highest yield
• Low cutting costs
• Perfect accessibility
• High machine utilisation
• Low re-fit times

Efficient slurry circuit - Adjustable wire tensioning system

The core of the DS 264 consists of the thermally and mechanically stable cutting unit and the integrated slurry circuit. For increased machine capacity, the DS 264 can be equipped with a slurry management. The constant cutting agent temperature and the adjustable wire tensioning system guarantee wafers of highest quality.