Wafers with the highest surface quality

The first class surface of the wafers as well as best warp and TTV values make the DS 261 the leading wire saw in the semi-conductor industry. It‘s compact and solid construction guarantee highest process stability on a small footprint. With it‘s technological and qualitative performance the DS 261 is in particular used for cutting 12 inch wafers.

• Fast and efficient cutting
• Best warp and TTV values
• Maximum nano-topological values
• Integrated workpiece orientation

Wide range of applications - Maximum yield

Besides silicon, the versatile DS 261 wire saw also cuts other hard and brittle materials such as quartz, sapphire or gallium arsenide in different dimensions. The high quality standard of the DS261 guarnatees maximum yield and best nano-topological values.