Gluing Station / Meyer Burger

Progress in the Gluing Process

The automatic gluing station sets new standards on the wafer line. A specially developed two-component adhesive is routed via the controllable mixing and measuring unit to the gluing site. Profi t from the constant, reproducible quality of its rational use. Optimum process sequences and the largest possible loading capacities for minimum handling are guaranteed. The gluing station can be linked into the process control system by means of an open interface, and thus becomes an integral part of the wafer line. You are investing in technology on highest level.

Safe, reproduciable process sequence
Controlled mixing and measuring unit
Automatic gluing and drying process
Simple, mild adhesive removal
Incorporation into process control system

Automatic handling and gluing

In addition to robotised handling, the fully integrated gluing unit offers a cleaning station, an infeed for workpiece carriers and glass plates, plus the delivery and removal of mono and multi bricks. Its advantage lies in a target oriented material flow with smooth handling of the workpieces. Integrate the unit into your process control system and get economic material flow and transparent process controlling.

Description	Specifications
Workpiece dimensions	variable 125 mm - 210 mm
Gluing rate	10 - 20 workpieces per hour (300-820 mm)
Handling	automated via robots
Brick length	180 - 800 mm
Recommended adhesive	two-component adhesive
Compatible with wire saws	DS 262, DS 264, DS 265
Machine dimensions l x w x h	10000 x 6000 x 2500 mm
Connection capacity	20 kW
Voltage / Frequency	400 V / 50 Hz
Compressed air	5 - 8 bar
Air extraction	approx. 1000 m³ / h
Process water feed / waste	max. 2.0 m³ ave. 0.5 m³ / h

Machine type	Workpiece holder length	Workpiece holder per hour
for DS 262 Wire saw	520 mm	max. 10
for DS 264 Wire saw	410 mm / 820 mm	max. 20 / max. 10
for DS 265 Wire saw	300 mm	max. 20 / max. 10

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