Full automation results in a reproducible process flow and guarantees the best possible utilisation and efficiency of cost-intensive processes. The brick line uses these advantages in the entire pre-sawing area and combines the process stages of measuring, edge and surface grinding, cropping and gluing in one closed system.  

Advantages 

• Full automation of cost-intensive processes
• Clear process identifiability and transparency
• Constantly high quality level 
• Maximum process reliability
• Optimum material flow
• Best Cost of Ownership  

 Brick line process stages

Before a silicon brick is processed into wafers using a wire saw, it passes through various process stages.A bar code is attached to the brick to identify it. The surface and edge grinding is then done in the grinding area. On the way to the cropping saw the brick is measured by an IR device and inspected for quality defects. The top and tail cropping is carried out by the inner diameter saw using this measurement data. It is here that the inclusions, the so-called Not in order NIO parts  are cut off. The NIO parts are then recycled and the quality compliant brick is moved along the conveyor belt to the fully automated gluing station. The final stage of the process is gluing the bricks to the workpiece holder. The gluing cell is programmed for maximum utilisation of the workpiece holder. The brick is now ready for processing with the wire saw.