The first class surface of the wafers as well as best warp and TTV values make the DS 261 the leading wire saw in the semi-conductor industry. It‘s compact and solid construction guarantee highest process stability on a small footprint. With it‘s technological and qualitative performance the DS 261 is in particular used for cutting 12 inch wafers.
Besides silicon, the versatile DS 261 wire saw also cuts other hard and brittle materials such as quartz, sapphire or gallium arsenide in different dimensions. The high quality standard of the DS261 guarnatees maximum yield and best nano-topological values.
| Workpiece dimensions | max. ø 305 mm (12") |
|---|---|
| Loading length | max. 400 mm |
| Example 1 | Example 2 | |
|---|---|---|
| Wafer size | 305 mm (12'') | 203 mm (8'') |
| Loading length | 400 mm | 400 mm |
| Wafer thickness | 950 µm | 830 µm |
| Wire thickness | 160 µm | 160 µm |
| Number of wafer per year* | ~160 · 103 | ~330 · 103 |
| * depends on customer's productions parameters |
