This version of the DS 265 has been developed especially for sapphire applications (e.g., LED manufacturing). It works exclusively with diamond wire and has an extremely high output due to the high cutting speed and long load length. Further advantages include its high flexibility and precision. Due to its wire break detection system as well as its optimised pulley design, the DS 265 is one step ahead of the competition.
The latest generation wire break detection system (which moniters the entire wire length) protects the material and WGRs by immediate machine shut-down. The rocking unit enhances cutting by reducing the wire contact length and cutting times. Furthermore, the DS 265 Diamond Wire is a compact machine with a small footprint.
| Workpiece format | max. Ø 8'' | |
|---|---|---|
| Loading length | max. 300 mm |
MB Wafertec the technology leader for precise cropping and slicing equipment of the Meyer Burger Group is developing a highly innovative product portfolio for the sapphire and LED industry including applications from the boule (crystal) until the EPI ready wafers and remarkably expanding this business segment.
It recently has won important orders in Europe (e.g. Monocrystal) as well as in China versus strong and established competitors. With an outstanding performance MB Wafertec has been able to convince with its wafering solution, with its comprehensive process know-how – including its infrastructure for testing and process development – and its wide product offering.
Based on the long experience acquired in photovoltaics slicing solargrade silicon as well as in optoelectronics slicing sapphire, MB Wafertec is providing outstanding expertise, products and even system solutions across the entire value chain. For the boules and cores this includes the handling, the orientation, and machining for the preparation of high precision wire saw workpiece. In the process of wafering the company has developed an application specific and highly upgraded wire saw, named DS265-Sapphire. This sapphire specific tool enables a high throughput (~1 Mio wafers 2” / year ) at highest quality. The wafer inspection and handling equipment is provided by the Meyer Burger group member Hennecke and secures a gentle and efficient processing of up to 3’600 wafers per hour in all formats ranging from 2” to 8”.
The equipment is full integrated with perfectly matching consumables including diamond wire and coolants. The latest process development shows exceptional wafering performance at highest quality and lowest costs (~<0.8 US$ / wafer 2” ). Favorable factors include the high wire lifetime, endurance of the wear parts and low maintenance and costs of the machine.
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