Our basic inner diameter saw combines the best cutting quality with minimum kerf loss.High quality and easy handling are additional features of the TS 207 Series-8. The machine can be manually loaded with mono crystalline silicon ingots or bricks and offers flexibility of use.
The series 8 allows users to orient the crystal axis to the blade prior to cutting whiche enables wafers to be cut perfectly parallel to the crystal lattice. This complies with highest demands of the semiconductor industry.
| Application | Semi + PV | |
|---|---|---|
| Material | Mono Si | |
| Cross sections | ø 100 - 215 mm | |
| Block length | 82 - 2100 mm | |
| Brick length | 50 - 760 mm |
