The inner diameter saw TS 207 Series 10 crops multi-crystalline silicon bricks. During cropping the position of a cut on the brick may be arbitrarily to guarantee highest yield. Testwafer can be cut with thickness of 0,8 – 25 mm. Loading and unloading of the bricks can be done manually as well as fully automated. The machine offers interfaces for connecting to production management systems and automated systems sucha as the BrickLine of Meyer Burger.
The process-independent loading and unloading positions guarantee that the machine can be loaded and unloaded manually or automatically without interrupting the cutting process.
| Application | PV |
|---|---|
| Material | Multi Si |
| Cross sections | ø 125, 156 mm |
| Block length | 50 - 500 mm |
| Brick length | 10 - 490 mm |
