The BS 830 continues the systematic development of band saws for monocrystalline silicon ingots. Precision and increased material utilisation are the main focus of the design. Ingots up to 3000 mm long are processed using a non-adhesive clamping technique. As a result, the tops and tails of the ingots can be recycled without concern about impurities from adhesive residue.
In the next step of the process, the crystals can be cut to exactly match the loading length of the wire saw, resulting in optimum and the utilisation of the saw.
A non-adhesive clamp allows squaring and chamfering of the ingot in one operation. Valuable material may be reused instead of being ground away. Thin saw bands coated with diamond grains can be used due to the small distance between the band guides. They guarantee low kerf loss and ensure maximum precision. The crystals are automatically centred and aligned in accordance with the drawing seams, thus guaranteeing consistent precision and quality.
| Series 3 | Series 4 | Series 5 | ||
|---|---|---|---|---|
| Workpiece dimensions | Ø 6'' (152 mm) or Ø 8'' (203 mm) or Ø 12'' (305mm); Max. Ø 330 mm | |||
| Max. workpiece length [mm] | 2500 | 3000 | 1100 | |
