| Machine | Technology | Industry |
| BS 801 | Band saw for sawing multi-silicon ingots up to 450mm | Photovoltaic |
| BS 805 | Band saw with rotating clamping table for squaring mono-silicon ingots up to 650mm in height and multi crystalline ingot blocks | Photovoltaic |
| BS 830 | Band saw for squaring and chamfering mono-silicon ingots up to 2500mm | Photovoltaic, Semiconductor |
| TS 23 | ID saw for individual cuts with a high-precision air bearing for separating a wide range of materials | Optics and Ceramics, Semiconductor |
| TS 121 | OD saw with one or various cutting discs | Optics and Ceramics |
| TS 207 | Largest inner diameter saw for the cropping of mono- or multi silicon blocks | Photovoltaic, Semiconductor |
| DWT | Diamond wire saws for the cutting of small quantites and of special materials with diamond wire | Optics and Ceramics |
| DS 261 | High-precision saw for the separation of semiconductor wafers with the highest quality requirements | Semiconductor |
| DS 262 | Largest wire saw with a double table system and a maximum sawing capacity of four bricks | Photovoltaic, Semiconductor |
| DS 264 | The most modern wire saw with modular construction, saws very thin solar wafers with a low level of slurry consumption at low manufacturing costs | Photovoltaic, Semiconductor |
| DS 265 | Small wire saw for the separation of two bricks or wafers up to 8 inches; works both with slurry and with diamond wire; offering an option of a rocking unit for special applications | Photovoltaic, Optics and Ceramics, Semiconductor |
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