Best cutting quality at minimum kerf loss for PV and semiconductor industry

The basic model of our inner diameter saws convinces with best cutting quality and minimum kerf loss. The high quality and a easy handling are more features of the basic model series 8. The machine can be manually loaded with mono crystalline silicon ingots or bricks and is flexible in operation.  

• High capacity
• Mono crystalline silicon ingots or bricks
• Flexible use
• High surface and cutting quality

Orientable crystal axis

The option of an orientation of the crystal axis before the cutting process complies with highest quality objectives of semiconductor industry. This option allows cutting of wafers perfectly parallel to the crystal lattice.