Fully automated cutting of top & tail and bricks of mono c-Si Ingots

Innerdiameter saw TS 207 Series 13 cuts round and squared mono crystalline Ingots. During the process the machine chooses the cutting position on the brick flexibly to guarantee highest yield. Automatic cutting of test wafers and cutting of top & tail are facts that make TS 207 Series 13 unbeatable in the functional range. The machine can be loaded and unloaded manually or fully automated. The inner diameter saw is equipped with interfaces for the integration of production management systems and robotic guided systems such as the BrickLine of Meyer Burger.

• High capacity, flexibility and yield
  
• Manual or fully automated loading and unloading
  
• Automatic cutting of test wafers and cutting of top/tail
• High surface and cutting quality 
  

Automated vacuum unloading system  

As an option the unloading of top and tail cuts of ingots can be done with a vacuum unloading system. The machine can be integrated in a full automated work flow. Consequently the degree of automation in the production process can be raised.