Fully automated cropping of multi c-Si Bricks

The inner diameter saw TS 207 Series 10 crops mutli crystalline silicon bricks. During the process the machine chooses the cutting position on the brick flexibly to guarantee highest yield. Inclusions can be cut out with minimum blade thickness of 0,8 – 25 mm. Loading und unloading of the bricks can be done manually as well as fully automated. The machine offers interface for the integration of production management systems and automated systems sucha s the BrickLine of MEyer Burger.  

  • High capacity, flexibility and yield
  • Manual or fully automated loading and unloading
  • Variable choice of cutting position on each brick
  • High surface and cutting quality  


Continuous processing at maximum capacity
 

The process independent loading and unloading guarantee a continuous cutting process. The machine can be loaded and unloaded manually or fully automated without interrupting the working process.

Description  
Process cropping of multi c-Si bricks
Workpiece geometry squared ingots
Workpiece dimensions 125 x 125 mm and 156 x 156 mm
Loading length 50 - 500 mm
Workpiece weight max. 30 kg
Brick lenght 10 - 480 mm
Test wafer 0.8 - 25 mm
Cutting feed ~ 40 mm / min
Loading / unloading manual, automated
Machine dimensions, l x w x h   4510 x 3200 x 2500 mm
Machine weight 8000 kg
Connection capacity 6,5 kW
Voltage / frequency 400 V / 50 Hz; 480 V / 60 Hz
Compressed air 6 - 8 bar; 60 m3/h
   
 

Description Specifications
External diameter 34'' / 860 mm
Internal diameter 12'' - 13" / 305 - 330 mm
Core plate thickness 0,15 - 0,18 mm
Diamond surface thickness max. 0,43 mm