A Cutting Length in Advance

The BS 830 continues the consistent development of band saws in the sphere of mono-silicon ingots. Precision and increased material utilisation are the main focus of the new design. Ingots up to 3000 mm long are processed in a non-adhesive clamping operation. As a result, the tops and tails of the crystals can be recycled free of the impurities from adhesive residues. In the next process stage the crystals can be cut exactly to match the loading length of the wire saw and the utilisation of the wire saw optimised as a result.

• Horizontal cutting process
• Squaring and chamfering of mono-silicon ingots
• 1 ingot up to 3000 mm in one clamping movement
• Use of diamond tools

Squaring and chamfering in one clamping movement

A non-adhesive attachment allows the squaring and chamfering of the ingot in one clamping operation. Valuable material is re-used instead of being ground away. Thin saw bands coated with diamond grains can be used due to the small distance between the band guides.  They guarantee low kerf loss for maximum precision. The crystals are automatically centred and aligned in accordance with the drawing seams, thus guaranteeing high consistency of precision and quality.