Processing Jumbo ingots

Over 20 % increase of cutting range for top cuts of jumbo ingots. The band saw BS 806 is the ideal saw for cutting multi-silicon jumbo ingots in the PV industry. Horizontal and vertical cutting of ingots up to sizes of 890 x 890 mm is possible. With the newly launched band saw BS 806 Meyer Burger expands its marketproven band saw technology and meets the demands of the industry to process jumbo ingots. Customers profit from fast cutting and high productivity.

• Vertical top cuts of ingots
• More than 20 % increase of cutting range
• High cutting feed
• Cutting / Squaring / Chamfering / Cropping blocks

Increased productivity

Diamond tipped sawing bands are successfully used for cutting and chamfering of silicon ingots. Galvanic bonded diamonds feature a high number of cutting edges, which results in an excellent cutting performance. The continous monitoring of the band tension combined with the aerostatic band guides ensure a precise cut with maximum surface quality and productivity.