2010

• Merger with 3S Industries Ltd, the leading provider of manufacturing equipment and entire production lines for the manufacturing of solar modules. Core competencies include 3S Swiss Solar Systems Ltd (laminating), Somont GmbH (electrical cell connection, soldering process) and Pasan SA (testing and measuring of solar cells and modules)

2009

• Market launch of BrickMaster for cutting multicrystalline silicon ingots into square bricks Acquisition of business activities of Diamond Wire Technology, LLC, Colorado Springs, USA (producer of diamond wire)
• Acquisition of the remaining 49% share capital of AMB Apparate + Maschinenbau GmbH
• Strategic cooperation with OC Oerlikon Balzers Ltd for the distribution and further development of the Solaris systems used for the coating of crystalline solar silicon cells

2008

•  Acquisition of majority participations in Hennecke Systems GmbH (precision measurement and sorting systems for solar wafers) and AMB Apparate + Maschinenbau GmbH (wafer handling and automation technologies) 

2007

• Announcement of the acquisition of majority participations in Hennecke Systems GmbH (wafer measurement systems) and AMB Apparate + Maschinenbau GmbH (wafer automation systems)
• Closing of purchase contracts January / February 2008
• Market launch of a fully-automated and integrated brick line for monocrystalline and multicrystalline silicon bricks

2006

• Holding name changed to Meyer Burger Technology Ltd, incorporated in Baar, Switzerland
• Initial Public Offering on 23 November 2006 at SWX Swiss Exchange

2005

• Market launch of wire saw DS 264
• Joint venture with SiC Processing Ltd., Wuxi, China

2004
Launch of band saw with rotating clamping table BS 805 for solar industry and of wire saw DS 265

2003

• Market launch of diamond wire saws in cooperation with Diamond Wire Technology, LLC, USA
• Foundation of subsidiaries in China and Japan, positioning in the Asian markets, Entering the Russian market through agreement with sales agent High Tech Solutions Moscow, Entering the Asian and American markets through cooperation with SiC Processing to ensure slurry-recycling supply of Meyer Burger customers

2002

• Launch of wire saw DS 261, specially targeted at 2’’ semiconductor industry
• Further development of band saw BS 800 into BS 801

2000
Market launch of the first wire saw DS 262, which was specifically targeted at the solar industry

1999
Incorporation of Meyer & Burger Holding Ltd, incorporated in Zug, SwitzerlandMarket launch of the first band saw BS 800 for solar industry and of wire saw DS 261 for semiconductor industry

1998
Development of band saw for wafer mass production

1992
Market launch of ID saw TS 207

1991
Market launch of the first wire saw DS 260

1985
Market launch of OD saw TS 121

1980
Development of a saw based on wire saw technology

1977
Market launch of first ID saw TS 23

1975
Market launch of gang saw GS 1

after 1970
Development of ID saw and start of cutting of silicon wafers for the semiconductor industry

1960
Market launch of first OD saw TS 3

1954
First delivery of a “Creusomat” (watch jewel manufacturing machine)

1953
Foundation of Meyer & Burger Ltd with focus on watch jewel manufacturing machines