For more than 50 years Meyer Burger Ltd has been specialising in the development and production of sawing machines for slicing hard and brittle materials. Our wire, band and ID/OD saws cut valuable silicon, sapphire or other crystals into thinnest wafers, prisms and other shapes. Every cut meets the highest quality demands of the solar, semiconductor and optical industry and features the absolute minimum kerf loss.

Meyer Burger Ltd is your specialist for 
 

• Advanced cutting technologies
• Precision cutting quality for extremely low kerf loss
• Maximum process reliability
• Best Cost of Ownership