| 2011 |
|---|
| Market launch of the diamond wire based BM 860 for bricking/squaring mono and multi silicon for handling G5, G6, 6” and 8” as an addition to the BM 850 |
| 2010 |
|---|
| Meyer Burger Ltd. and Meyer Burger Automation GmbH get new branding |
| Market launch of diamond wire technology on BrickMaster BM 850 |
| Market launch of wire saw DS 265 Diamond Wire for sapphire applications |
| 2009 |
|---|
| Market launch of process and quality management system PQMS |
| Market launch of semi-automated gluing station GlueMaster in cooperation with group member Meyer Burger Automation GmbH |
| Market launch of BrickMaster for cutting multicrystalline silicon ingots into square bricks |
| Market launch of band saw BS 806 for cropping multicrystalline silicon |
| 2008 |
|---|
| Market launch of wire saw DS 271 with 20% increased loading capacity |
| Market launch of band saw BS 830 for squaring of monocristalline silicon |
| 2007 |
|---|
| Meyer Burger Ltd. gets new branding |
| Creation of the subsidiary Meyer Burger Automation GmbH in Germany by Meyer Burger Technology Ltd. |
| Market launch of fully automated and integrated BrickLine and fully automated gluing station for mono- and multicrystalline silicon bricks in cooperation with Meyer Burger Automation GmbH |
| 2005 |
|---|
| Market launch of wire saw DS 264 |
| 2004 |
|---|
| Market launch of band saw with rotating clamping table BS 805 for the solar industry and wire saw DS 265 |
| 2003 |
|---|
| Creation of subsidiaries in China and Japan, and a position in the Asian markets |
| Entry into the Russian market through an agreement with sales agent High Tech Solutions Moscow |
| Entry into the Asian and American markets through cooperation with SiC Processing in Germany to ensure slurry- recycling for Meyer Burger customers |
| 2002 |
|---|
| Launch of wire saw DS 261, specifically targeted at the 2’’ semiconductor industry |
| Further development of band saw BS 800 into BS 801 |
| 2000 |
|---|
| Market launch of first wire saw DS 262, specifically targeted at the solar industry |
| 1999 |
|---|
| Incorporation of Meyer & Burger Holding Ltd. in Zug, Switzerland |
| Market launch of first band saw BS 800 for the solar industry and wire saw DS 261 for the semiconductor industry |
| 1998 |
|---|
| Development of band saw for mass production of wafers |
| 1992 |
|---|
| Market launch of ID saw TS 207 |
| 1991 |
|---|
| Market launch of first wire saw DS 260 |
| 1985 |
|---|
| Market launch of OD saw TS 121 |
| 1980 |
|---|
| Development of a saw based on wire sawing technology |
| 1977 |
|---|
| Market launch of first ID saw TS 23 |
| 1975 |
|---|
| Market launch of gang saw GS 1a |
| 1970 |
|---|
| Development of ID saw and start of silicon wafer cutting for the semiconductor industry |
| 1960 |
|---|
| Market launch of first OD saw TS 3 |
| 1954 |
|---|
| First delivery of Creusomat (watch jewel manufacturing machine) |
| 1953 |
|---|
| Foundation of Meyer & Burger Ltd. with focus on watch jewel manufacturing machines |
